日本と海外をつなぐクラウドソーシング

Sr PROCESS ENGINEER (Lumileds & Sandisk)
-Documentation:SOP, FMEA, OCAP & Control Plan (English, Malay, Chinese)
-New process & product development
-NPI
-Continuous improvement, cost down & yield enhancement
-Follow up non-conformance
-Coordinator for audit
-Handling tape laminating (Nitto)
-Handling backgrinding (Disco & Accretech)
-Die preparation process
-Problem solving skills
ACCOMPLISHMENT
-Yield improvement for Die Preparation process, reducing die crack DPPM by 77%

CUSTOMER ENGINEER (Disco Hi-Tec)
-Experience in wafer grinding knowledge (mechanical & application)
-Experts in DISCO grinding and polishing machines (800 & 8000 series) & wafer mounter.
-Experience in troubleshooting wafer & machine problems.
-Experience in improving product quality & UPH
-Experience in providing training
-Experience in project planning for new setup and tools recovery

Education:
University of Science Malaysia Bachelor's Degree
Major: Physics Engineering
CGPA:3.25/4