日本と海外をつなぐクラウドソーシング

Yamaha Robotics Engineering Asia Co., Ltd( Former name: Shinkawa Vietnam Co. Ltd)

Manager

2012/04～ 2023/05

- Managed projects/tasks which developed/maintained software for Wire Bonder machine (being used in semiconductor).
- Managed schedule to ensure finishing on time and staying on budget.
- Analyzed business requirements and transferred to team members.
- Worked as Window teller between HQ and Vietnam offices.
- Monitoring whole Vietnam office.
- 6 months onsite in Thailand to setup software development process to work/support factory and customer in South East Asia.
- Business trip to support Customer (Thailand, Singapore, Malaysia): troubleshooting, buy-off new function, discuss requirement.

Achievements:
- Schedule management
- Communication skill
- Personnel related skill
- Negotiation skill.
- Business requirement analysis

Shinkawa Vietnam Co. Ltd

Leader

2010/10～ 2012/03

- Analyzed business requirements.
- Created specifications (Function & detail specification) in English.
- Developed/maintained software for Wire Bonder machine (being used in semiconductor).
- Implemented the function with designed specification including creating test cases and tests.
- Managed team of 8 members.
- Worked as Window teller between HQ and Vietnam office.

Achievements:
- Requirement analysis.
- Management skill.

Shinkawa Vietnam Co. Ltd

Software Engineer

2009/08～ 2010/10

- Created specifications (Function & detail specification) in Japanese.
- Implemented new functions based on Customer requirement.
- Developed new platform software(C#, C++/CLI (.NET framework) for Wire Bonder machine (being used in semiconductor).

Achievements:
- C#, C++/CLI( .NET framework)

Shinkawa Japan .Ltd

Software Engineer

2007/08～ 2008/07

- Trained about Wire Bonder machine.
- Trained about software development cycle of Wire bonder.
- Trained Japanese language and how to write specification.
- Improved/ fixed software bugs.
- Implement new function based on Customer requirement.
- Developed new platform software (C#, C++/CLI (.NET framework) for Wire Bonder machine (being used in semiconductor).
- Created specification (Function specification, detail specification) by Japanese for new platform software of Wire bonder.

Achievements:
- C#, C++/CLI( .NET framework)
- Software design skill.
- Specification writing skill.

Jesco SE Vietnam Co., Ltd

Software Engineer

2006/10～ 2007/07

- Prepared Japanese skill to go Shinkawa Ltd for training and working within 2 years.
- Trained about Wire Bonder software as basically.
- Improved programming skill before going to Shinkawa Ltd.

Delivery Vietnam Co., Ltd

Software Engineer

2006/07～ 2006/10

- Developed application and game for mobile (Japan market).
- Unit test.

Achievements:
- Java (JSP, Struts Framework, Spring, Hibernate).
- Database: Oracle 10i
- Unit test: jUnit, djUnit.