日本と海外をつなぐクラウドソーシング

Bethany Consultancy

ICT and Advanced Maths

2017/07～

· Benchmarked, Designed, and Implementation of Advanced Curriculum for Physics, Math and ICT for an ESL compatible setting.
· Designed and implemented integrated curriculum for Level 12 Robotics to be granted STEM strand in K-12 accreditation.
· Teaching Robotics, Physics, Advanced Math, Pre-Calculus and ICT Subjects
· In-charge of records and reports on students.
· Using SOT (ACE) strategies and techniques to enhance the development of students' language, memory, sensory and perceptual-motor skills
· Preparing and grading assignments and examinations
· Leading classroom activities
· Counseling students
· Educating parents on how to address their child's performance.
· Teaching students skills for independence and daily living, and future roles in society.

Advanced Semiconductor Engineering, Incorporated

Product Project Integration Engineer Semiconductors

2001/07～

· Spearheads with the customer on technical/process-related inquiries and communications thru regular teleconferencing and communications.
· Specialized skill set is on phasing in advanced packaging devices on BGA, wCSP, SiP, MEMS, and nanotechnology from RD phase to mass production phase.
· Champions closure and resolution of customer's packaging assembly related issues.
· Review/Monitor Weekly Process Yields and PPM performance per customer assignments.
· Responsible for integrating the team for providing improvement and resolution plans.
· Leads 8D generation on assembly process-related issues, analyses defect mode thru FMEA, JMP, and latest Problem Solving Methodologies.
· Maintains Hazardous Material Chemical Databank.
· Monitors Qualification lots and devices phased-in to production mode.
· Responsible for highlighting discrepant items to customer and/or provisions of alternate proposal for agreement on implementing procedures.
· Conducts comparative analysis and recommends applicable package based on customer requirements and design rules as set by existing process capability and yield requirements.
· Develops new procedures, methods and system automation for quality, productivity, cost-reduction and yield improvements.
· Contribute to cost control program by promoting standards materials thus, enhance manufacturing control and inventory set-up.
· Conduct validation studies as per defined assembly design rules.
· Conduct extensive analysis on process-related problems and formulates solutions through Poka-Yoke and PSM approach.
· Conducts technical presentation on new package technology.
· Member of customer audit team and technical audit team.
· Review external customer documents and generates comparison table to stipulate differences on process specification and make recommendations based on process capability.

Amkor Technologies Philippines

Product Device Qualification Engineer

1996/12～ 2001/07

· Functions as team leader to a pool engineers and technical assistants.
· Specialized skill set on BGA and Flip Chip packages phase in from RD phase to mass production.
· Responsible for reviewing and screening assembly build instructions (Assembly Process Flow and Conditions, BOM, Marking, Bonding Diagram). This is to ensure accuracy, clarity, and completeness of build informations required on-time and compliant assembly processing of devices.
· Responsible for Lot Traveller Card (LTC) generation, inclusive of recipe and characterization parameters.
· Responsible for buy-off of Wirebond diagram and PCB drawings.
· Responsible for Product Data Base (PDB) Maintenance, Customer Process Flow (CPF) generation and customer specification review.